表 15 铅及铅化合物的应用代码代表(合金成分，焊料，陶瓷中的铅)
ID
APPLICATION (英语)
3 28
Alloying element in copper
53 Lead in solder used in electronic circuit board applications – 8a)
54 Lead in solders in electrical applications other than soldering on electronic circuit boards or on glass
– 8b)
55 Lead in finishes on terminals of electrolyte aluminum capacitors – 8c
56 Lead used in soldering on glass in mass airflow sensors – 8d)
展开剩余88%57 Lead in high melting temperature type solders(i.e.lead-based alloys containing 85% by weight or
more lea) – 8e)
58 Lead in compliant pin connector systems – 8f)
60 Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies – 8h)
61 Lead in solders in electrical glazing applications on glass except for soldering in laminated glazing -
8i)
62 Lead in solder for soldering in laminated glazing – 8j)
63 10(a) - Electrical and electronic components which contain lead in a glass or ceramic, in a glass or
ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.
This exemption does not cover the use of lead in: — glass in bulbs and glaze of spark plugs, dielectric
ceramic materials of components listed under 10(b), 10(c) and 10(d).
64 10(b) - Lead in PZT based dielectric ceramic materials of capacitors being part of integrated circuits
or discrete semiconductors
65 10(c) - Lead in dielectric ceramic materials of capacitors with a rated voltage of less than 125 V AC
or 250 V DC
66 10(d) - Lead in the dielectric ceramic materials of capacitors compensating the temperature-related
deviations of sensors in ultrasonic sonar systems
67 8f) (a) - Lead in compliant pin connector systems
68 8f) (b) - Lead in compliant pin connector systems other than the mating area of vehicle harness
connectors
69 Steel for machining purposes and batch hot dip galvanized steel components containing up to 0.35%
lead by weight701
70 1(b) - Continuously galvanized steel sheet containing up to 0.35% lead by weight712
71 2(a),(b),(c)(i) - Alloying element in aluminum for machining purposes
72 2(c)(ii) - Recycled aluminum alloy containing unintentionally added lead735
75 8(g)(i) - Lead in solders to complete a viable electrical connection between semiconductor die and
carrier within integrated circuit flip chip packages
76 8(g)(ii-i) - Lead in solders to complete a viable electrical connection between the semiconductor die
and the carrier within integrated circuit flip chip packages where that electrical connection consists of
注） **********************************************************************************************************
28 No.53的英语内容是直接引用IMDS中的记述。为ELV指令AnnexⅡ「8a」的省略形。 No.AQP-SP04-31E (24/37)
NIDEC MOBILITY CORPORATION
ID
APPLICATION (英语)
a semiconductor technology node of 90 nm or larger
77 8(g)(ii-ii) - Lead in solders to complete a viable electrical connection between the semiconductor die
and the carrier within integrated circuit flip chip packages where that electrical connection consists of
a single die of 300 mm₂ or larger in any semiconductor technology node
78 8(g)(ii-iii) - Lead in solders to complete a viable electrical connection between the semiconductor die
and the carrier within integrated circuit flip chip packages where that electrical connection consists of
stacked die packages with dies of 300 mm² or larger, or silicon interposers of 300 mm² or larger
79 8(k) - Soldering of heating applications with 0,5A or more of heat current per related solder joint to
single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not
cover soldering to contacts embedded in the intermediate polymer
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